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LeMaker HiKey 960™ 3GB, Octa Core 4xARM® Cortex® A73 + 4xA53 64-Bit-CPU, Mali™ G71 MP8 3D GPU, 96board

Hersteller: ALLNET

Artikel-Nr.: 140497

Hersteller Artikel-Nr.: Lemaker_HiKey960

Gewicht: 0.08kg

EAN Nummer: 4038816064349

Preise zzgl. gesetzlicher MwSt.
zzgl. Versandkosten

 

LeMaker HiKey 960™ 3GB, Octa Core 4xARM® Cortex® A73 + 4xA53 64-Bit-CPU, Mali™ G71 MP8 3D GPU, 96board

LeMaker´s Nachfolger des Hikey-Boards heißt HiKey960™, mit leistungsstarken Hisilicon Kirin 960 Prozessor, welcher im Huawei™ Mate 9 Smartphone steckt.Mit 3GB LPDDR4 Speicher, 32GB UFS Speicher, HDMI, USB 3.0 Ports und M.2 Schnittstelle, bietet das Board enorme Leistungsreserven.

Es wird ein Adapter mit 4,75 mm DC-Plug für die Stromzufuhr oder ein Netzteil mit diesem Stecker benötigt:

Endkunden können über www.innet24.de bestellen.

 

Infos zu den 96boards unter https://www.96boards.org.

 

•Kirin™ 960 SoC

•4*Cortex® A73 + 4*Cortex™ A53 Big.Little™ CPU architecture

•ARM® Mali™ G71 MP8 3D GPU

•3GB LP-DDR4 DRAM

•32GB UFS Flash

•Wi-Fi 802.11 a/b/g/n 2.4G/5.0G dual band + BT 4.1

•PCIE Gen2 on M.2 M Key connector

•2 x USB 3.0 type A (host mode only)

•1 x USB 2.0 type C (OTG)

•Micro SD card slot (SD2.0)

•HDMI Type A Port (1080p HD @ 30fps)

•40-pin LS PIN: I2S, 2*UART, 2*I2C, SPI, 12*GPIO

•60-pin HS PIN: 4L-MIPI DSI, 2L+4L MIPI CSI, 2*I2C, 2*SPI (48M), USB 2.0

 

•Google Android Open Source Project

•GPU:based on ARM DDK, source code in kernel and *.so in HAL

•2D accelerator and Video accelerator: source code in kernel, .*so in HAL, documents for API of *.so

•Enable ability for OP-TEE: source code with Crypto, ATF and UEFI with open source

•Audio: I2S enablement, HiFi-DSP sub-system, sample code

•Camera: CSI enablement, sample code

•HDMI: DSI driver code, audio driver code

•LCD:DSI driver code, sample code to show how to use LeMakerMIPI LCD

•WiFi/Bluetooth: source code

•Linarosoftware reference platform based on Debian

•Kernel will support the latest upstream version

•OpenEmbeddedreference build

•All interface driver source code including CSI, DSI, SDIO, HDMI, etc

•GPIO control sample code

Hardware Specification Comparison Between HiKey 960 and HiKey 620
Item HiKey 960 HiKey 620
SOC Kirin 960 SoC Kirin 620 SoC
CPU 4*Cortex A73 + 4*CortexTM A53 Big.Little CPU architecture 8*Cortex A53
GPU Mali G71 MP8 GPU Mali 450 MP4 GPU
RAM 3GB LPDDR4 2GB LPDDR3
PMIC Hi6421GWCV530 Hi6422GWCV211 Hi6422GWCV212 Hi6553V100
Storage 32GB UFS flash on-board storage
MicroSD card
8GB eMMC flash
MicroSD card
Display HDMI 1.4 (Type A-full)
MIPI DSI
HDMI 1.4 (Type A-full)
MIPI DSI
Camera Support One 4-lane MIPI CSI
One 2-lane MIPI CSI
One 4-lane MIPI CSI
One 2-lane MIPI CSI
Audio HDMI output HDMI output
USB 2*USB 3.0 type A (host mode only)
1*USB 2.0 type C OTG
2*USB 2.0 type A (host mode only)
1*USB 2.0 microB OTG
PCIE PCIE Gen2 on M.2 M Key connector NO
Wireless WiFi(2.4- and 5-GHZ dual band with two antennas)
Bluetooth
WiFi(2.4GHZ band with one antenna)
Bluetooth
Expansion Connector 40-pin Low Speed expansion connector: I2S, 2*UART, 2*I2C, SPI, 12*GPIO, DC power
60-pin High Speed expansion connector: 4L-MIPI DSI, 2*I2C, SPI (48M), USB 2.0, 2L+4LMIPI CSI
40-pin Low Speed expansion connector: I2S, 2*UART, 2*I2C, SPI, 12*GPIO, DC power
60-pin High Speed expansion connector: 4L-MIPI DSI, 2*I2C, SDIO, USB 2.0, 2L+5LMIPI CSI
OS-support AOSP/LINUX AOSP/LINUX
Power Power: 8V-18V@2A input Power: 8V-18V@2A input.
Appearance Characteristic
Sizes 85mm x 55mm 85mm x 55mm

•Tools for flash OS: https://github.com/96boards-hikey/tools-images-hikey960

•AOSP build instruction: https://github.com/96boards-hikey/android_manifest

•Board configuration for AOSP: https://github.com/96boards-hikey/android_device_linaro_hikey

•AOSP kernel: https://github.com/96boards-hikey/android_device_linaro_hikey-kernel/tree/master

•Documentation: https://github.com/96boards/documentation

•Product page: http://www.lemaker.org/product-hikey960-index.html


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